Job Overview

We are seeking an experienced engineering leader to manage our integrated Hardware and Signal Integrity organization for high-speed external cable assemblies. The role owns the engineering lifecycle from architecture, simulation, hardware and PCB design through bring-up, qualification, production support, and customer issue resolution. The manager will drive passive and active copper solutions across OSFP, QSFP-DD (QDD), QSFP, OSFP-XD, CDFP, breakout, and emerging high-density form factors for Ethernet, AI infrastructure, and PCIe applications.

Technology and Product Scope

•    External cable assembly platforms using OSFP, QSFP-DD (QDD), QSFP, OSFP-XD, CDFP, and future high-density form factors.
•    Passive Direct Attach Copper (DAC), redriver-based Active Copper Cable (ACC), and retimer-based Active Electrical Cable (AEC) architectures.
•    High-speed electrical channels supporting 112G, 224G, and future 448G and beyond lane-rate technologies, including Ethernet and PCIe applications.
•    End-to-end design considerations spanning connector and paddle-card interfaces, cable performance, PCB routing, power integrity, EMI/EMC, thermal management, firmware interfaces, and system interoperability.

Job Requirements

•    Lead global Hardware, PCB Design, and Signal Integrity engineering teams across passive and active external cable products.
•    Own electrical architecture, hardware design, SI/PI analysis, PCB implementation, and design verification.
•    Drive ACC development using linear redriver technology, including equalization strategy, power delivery, thermal performance, and link-margin optimization.
•    Drive AEC development using retimer technology, including SerDes architecture, clocking, power and thermal design, device integration, firmware interfaces, and end-to-end interoperability.
•    Manage form-factor implementation and design trade-offs for OSFP, QSFP-DD (QDD), QSFP, OSFP-XD, CDFP, breakouts, and new platform concepts.
•    Drive products from concept and simulation through prototype bring-up, qualification, customer validation, and production release.
•    Establish common design rules, simulation methodology, technical standards, design reviews, and reusable engineering assets.
•    Improve correlation among simulation, S-parameter measurements, laboratory characterization, and system-level BER/FEC performance.
•    Handle and support root-cause investigations for complex hardware, SI, EMI, thermal, manufacturing, and customer issues.
•    Partner with Product Management, IC suppliers, Firmware, Software, Validation, Manufacturing, Quality, Sourcing, and customer engineering teams.

What your background should look like

•    BS or advanced degree in Electrical Engineering or a related discipline.
•    12+ years of relevant engineering experience, including 5+ years in technical or people leadership.
•    Strong expertise in high-speed hardware design, signal and power integrity, PCB design, channel modeling, S-parameters, SerDes, and laboratory characterization.
•    Hands-on understanding of DAC, redriver-based ACC, and retimer-based AEC product architectures.
•    Experience with OSFP, QSFP-DD, QSFP, OSFP-XD, CDFP, or comparable high-speed pluggable and cabled I/O form factors.
•    Experience spear heading complex products from architecture through qualification and production, preferably within Ethernet, AI infrastructure, networking, or PCIe ecosystems.
•    Demonstrated ability to lead global teams and work across engineering, operations, suppliers, and customer-facing organizations.

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Competencies