ASIC Product Design Engineer

Why you should join:

As part of the ASIC design team within TE Sensors Solutions based in TE Connectivity Romania, we are looking for an IC Design Engineer to define and design the ASIC’s circuitry for magneto-resistive and MEMS automotive sensors. The products consist of analog front end ( AFE ), signal processing circuits interfacing with digital content. 

You will work with product development, product management, application engineering teams and interface with customers. In this role, you should be able to work independently with little supervision. You should have excellent organization and problem-solving skills as well as hands-on experience in magneto-resistive sensors’ ASIC concept, IC design, gathering technical information from customers and write ASIC’s block specification. 
 

Your main tasks:

• Define the signal path for our magneto-resistive and MEMS sensor products 
• Determine signal processing circuit requirements (quantization, sampling, specs) to meet overall system requirements
• Perform transistor level schematic design, layout design and simulations of mixed signal circuit blocks 
• Work with the layout team to ensure proper execution of our IC products 
• Collaborate with the validation, test, and qualification teams to make sure the product meets all the specifications and is ready for high volume manufacturing 
• Provide detailed technical documentation with specifications, block diagrams, and requirements to stakeholders 
• Collaborate closely with different departments/stakeholders including Test/Validation/Application Engineering, and Reliability/Qualification/Operations to resolve design, application, or test issues

Your ideal background:

• Bachelor, MS or Ph.D degree in Electrical Engineering or equivalent 
• Proven 3 years minimum experience in IC design preferable sensors’ ASIC product design 
• Cadence IC design tools work experience 
• Experience with correction algorithms, calibration, and testability of these circuits
• Proven hands-on experience in design and layout Cadence tools and silicon debug capability as a plus
• Experience in Automotive IC Design CMOS/BCD process
• Self-motivated individual with technical, analytical and communication skills to drive project across multiple cross-geo organizations
• Fluent communication skills facilitating collaboration with global teams, internal business leaders, and technology leaders

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