STAFF R&D/PRODUCT DVL ENGINEER (Socket SI)

Job Overview

TE Connectivity’s Product Engineering Teams optimize existing products from information or input provided by marketing, customers, Operation Teams, Development Engineers or other employees. They maintain existing products, processes, and specifications including modifications for new applications consistent with manufacturing techniques and economies. They also initiate and implement programs to continuously improve quality, and cost, while meeting customer requirements and may support and implement product extensions to existing platform products to meet specific customer requirements. They are the key experts in the products they are responsible for at TE.

What your background should look like:

Responsibilities:
•    Subject matter expert in signal integrity design, simulation and validation activities through product development cycles
•    Establishing signal integrity design performance/functional requirements for new products
•    Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
•    Performing PCB design schematic and layout reviews
•    Creating actionable recommendations based upon design reviews and simulation results
•    Guiding connector design and component qualifications from a signal integrity standpoint.  Making data driven decisions about the product functionality and areas for improvement.

Required Skills/Experience:
•    Bachelor’s degree in Electrical Engineering or equivalent work experience
•    8+ years of relevant work experience in electrical design, RF design, or PCB design
•    Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
•    A solid understanding of electromagnetic theory and electrical circuit behavior 
•    Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.  
•    Familiarity with printed circuit board design, fabrication and assembly.  
•    Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers.
•    Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.
•    Individual must be highly motivated, a quick learner, and able to work independently

 Nice to Have Skills/Experience:
•    Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system
•    Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems)
•    Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English
•    Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction.
•    SixSigma methodologies or other strong data analytics background.
•    Printed circuit board design, fabrication and assembly (Altium, AutoCAD)
•    Experience in project leadership, especially as it applies across design, development & manufacturing teams
•    Test equipment (oscilloscope, vector network analyzer, BERT)
•    Signal conditioning techniques (equalization, amplification)
•    Direct customer design and support experience
•    Application and test knowledge of high-speed devices and equalization techniques
 

Competencies