MGR II R&D/PRODUCT DVL ENGINEERING

Job Overview

TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems.

What your background should look like:

Skills/Experience:
•    Bachelor’s degree in Electrical Engineering or equivalent work experience; Master's Degree preferred
•    Generally requires 10 years of relevant work experience in electrical Design , RF design or PCB design
•    Generally requires a minimum of 3 years of progressive leadership and people management experience in a regional environment
•    A solid understanding of electromagnetic theory and electrical circuit behavior
•    Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
•    Proficient with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)
•    Proficient with high-speed test equipment (VNA, TDR, BERT)
•    Proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.
•    Proficient with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially as associated with connector FP and card-edge interfaces
•    Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.
•    Practiced analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.
•    Fluent in English (both verbal and written)
•    Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.
•    Proficient in presenting technical solutions to customers and upper management
•    Proficient in building and leading a solid team - assessing talent fit (current team and future hires), aligning skills to business needs, identifying skillset gaps needed to strengthen the team, and taking actions necessary to maintain solid team performance.
•    Proficient at leading cross-functional new product development projects which require strong collaboration and influencing skills to achieve the right outcome for the business..
•    Proficient in leading change in a high-paced and dynamic environment with an understanding of common barriers to effectively managing change.
 

Competencies