SR MANAGER SIGNAL INTEGRITY - SI COE

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. 

Job Overview

Data communication technologies are advancing at unprecedented speed, and TE's Data and Devices Business Unit is leading this transformation. We empower a more connected, intelligent, and agile world by supporting the data center infrastructure and devices that redefine modern information technology. Our agile, fast-paced, and innovation-driven approach enables us to meet the ever-growing demands of a data-driven future.

 

As the Sr. Manager of the Signal Integrity Center of Excellence (SI COE), you will lead a high-performing team of signal integrity engineers driving next-generation high-speed interconnect technologies for data centers, and high-performance computing (HPC) applications. You will be responsible for setting the technical vision, managing research priorities, and enabling methodology development, advanced simulation, and innovation to support future products.

 

You will partner with global cross-functional teams—including product development, mechanical design, manufacturing, and materials science—to deliver scalable SI solutions and platform strategies. In this leadership role, you will ensure the team operates at the forefront of 224G/448G+ connectivity, resonance mitigation, and AI-assisted SI design while developing processes, tools, and standards for TE’s broader engineering community.

 

This is a high-impact leadership position requiring a deep technical foundation, strong people management skills, and the ability to drive strategic decision-making across multiple high-priority technical projects.

Responsibilities:

  • Lead and mentor the SI COE team, fostering technical growth, innovation, and collaboration.
  • Define and manage the strategic roadmap for SI research and platform-level initiatives, including simulation methodologies, design studies, and technology enablers.
  • Drive cross-functional collaboration to align SI capabilities with next-gen interconnect product needs across cloud, AI, and networking applications.
  • Oversee advanced research projects in mating interface design, leadframe optimization, cable performance, high-frequency test development, and resonance mitigation.
  • Champion the development and deployment of AI- and data-driven design tools, simulation workflows, and predictive modeling techniques.
  • Manage team resources, budgets, and project prioritization to meet organizational objectives.
  • Promote a culture of curiosity, technical excellence, and continuous improvement
  • Foster a culture of continuous learning, technical excellence, and innovation, ensuring the team remains at the forefront of compute and networking advancements.
  • Conduct regular performance reviews, provide constructive feedback, and create individualized development plans to accelerate career growth.
  • Recruit, retain, and develop world-class talent, ensuring TE has the technical expertise needed to lead the industry.
  • Encourage collaboration and knowledge sharing, breaking down silos and promoting cross-functional teamwork.
  • Provide leadership in system-level trade-offs, design decisions, and risk assessment.
  • Facilitate cross-functional collaboration, ensuring effective communication between technical teams, business leaders, and external partners.
  • Manage multiple high-impact projects, ensuring seamless execution from early-stage concept to product development.
  • Build and maintain strong relationships with key OEMs, hyperscalers, and industry leaders, ensuring TE is aligned with evolving customer needs.
  • Influence executive leaders and cross-functional stakeholders, driving investments in new technologies and product innovations.

What your background should look like:

  • Bachelor’s degree or higher in Electrical Engineering or Engineering Management; a dual degree in business or MBA is a plus.
  • 12+ years of technical experience in data center, compute, AI, networking, or storage industry, with at least 5+ years leading multi-disciplinary teams.
  • Experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR, and BERT).
  • Expertise in high-speed signaling, and electrical/optical interconnects is a plus
  • Proven track record of leading and motivating geographically dispersed, high-performance engineering teams with the ability to develop technical talent and drive innovation.
  • Ability to balance strategic and tactical execution.
  • Strong relationship-building skills, with experience engaging with external customers, industry leaders, and internal executives.
  • Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problems
  • Excellent presentation, verbal, and written communication skills with an ability to communicate technical concepts to diverse audiences
  • The individual must be highly motivated, a quick learner, and able to work independently
  • Willingness to travel (25-30%) for customer engagements, industry events, and TE development sites.

Competencies

Building Effective Teams
Motivating Others
Managing and Measuring Work
Values: Integrity, Accountability, Inclusion, Innovation, Teamwork
SET : Strategy, Execution, Talent (for managers)

COMPENSATION

  • Competitive base salary commensurate with experience: $177,800 – $266,700 (subject to change dependent on physical location)
  • Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
  • Total Compensation = Base Salary + Incentive(s) + Benefits
Location: 

#, PA, US, _

City:  #
State:  PA
Country/Region:  US
Travel:  10% to 25%
Requisition ID:  131754
Alternative Locations: 
Function:  Engineering & Technology


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