Job Overview

The Digital Data Networks (DDN) Business Unit is seeking a highly skilled and driven PRINCIPAL R&D/PRODUCT DVL ENGINEER within the Advanced Development (AD) team. In this key technical role, you will be responsible for spearheading structural mechanics, thermal-mechanical coupling, and multi-physics modeling to rapidly screen, evaluate, and down-select next-generation high-speed interconnect technology concepts. You will tackle critical engineering challenges across switches, servers, data storage systems, and AI hardware platforms—pushing the boundaries of density, signal integrity, and mechanical reliability.

As a senior technical contributor in the DDN Advanced Development team, you will establish first-principles analytical models and high-fidelity simulations to generate decision-quality performance predictions. You will lead simulation-driven design trade-offs, drive model-to-test correlation, and partner closely with cross-functional teams including Signal Integrity, Mechanical Design, Product Management, and Front-Line Product Engineering (PDE/NPI). Additionally, you will play an instrumental role in shaping the team’s Advanced Simulation roadmap and maturing virtual prototyping methodologies.

Key qualifications include a proven track record of superior technical expertise in finite element analysis (FEA), advanced mechanical and thermal-mechanical modeling, and a passion for engineering innovation. You are expected to drive prediction-driven decision-making through rigorous model verification and validation (V&V), clearly communicate engineering trade-offs, and mentor engineering peers in best simulation practices.

Job Requirements

• Lead the development, application, and continuous improvement of first-principles engineering analysis, FEA modeling, and multi-physics simulation to down-select solution concepts.

• Build first principles and reduced-order mechanical/thermal models to quickly screen early architectures and identify scaling limits.
• Execute advanced high-fidelity non-linear structural and thermal-mechanical simulations (e.g., elastoplastic deformation, creep, stress relaxation, thermal expansion/CTE mismatch, contact mechanics, and insertion/retention force).
• Perform sensitivity studies, tolerance stack-ups, and statistical variation analyses to understand assembly robustness, coplanarity, and risk early in the product lifecycle.
• Partner with design engineers to define simulation-ready geometry, boundary conditions, and loading scenarios supported by GD&T interpretation.
• Handle complex FEA models involving hundreds of components in high-speed interconnect systems to build high-fidelity simulation models. Simplify models as appropriate to balance simulation accuracy, computational efficiency, and delivery timelines.
• Deliver comprehensive simulation reports, actionable design recommendations, and technical presentations to drive executive and architectural down-selection.
• Define and lead physical prototype test plans; actively partner with test labs to execute model verification and validation (V&V), correlate experimental data with simulation results, and calibrate constitutive material models.
• Collaborate with PDE/NPI teams to ensure smooth handoff of validated simulation models, design guidelines, and predictive methodologies for commercialization.
• Champion simulation process automation, script development, and methodology standardization across the engineering group.
• Maintain deep awareness of cutting-edge simulation tools, high-performance computing (HPC/Cloud), advanced material systems, and emerging packaging/interconnect technologies.

What your background should look like

• Bachelor’s degree in Mechanical Engineering, Aerospace Engineering, Materials Science, or related field; Master’s Degree or Ph.D. strongly preferred.
• Generally requires 8–10+ years of progressive engineering experience in high-fidelity FEA and structural/thermal-mechanical analysis in high-tech electromechanical products, connectors, high-speed interconnects, or electronic packaging.
• Recognized technical expert in commercial FEA platforms (e.g., Ansys Mechanical, preferred) with demonstrated mastery in non-linear materials, complex contact interfaces, dynamic response, and thermal-stress coupling.
• Strong practical experience in test correlation and model calibration (e.g., strain gauge testing, displacement/force measurement, thermal warpage profiling).
• Deep understanding of high-speed interconnect architecture, micro-contact physics, spring pin design, socket/cable assemblies, and CTE management in AI/compute hardware environments.
• Working knowledge of 3D CAD platforms (Creo and SpaceClaim preferred) for geometric defeaturing, parameterization, and simulation prep.
• Experience with cloud/HPC simulation environments (e.g., Rescale) and automation scripting (Python, MATLAB) is a plus.
• Proven ability to work effectively in a cross-functional, global R&D environment, translating complex technical findings into actionable engineering guidance.
• Excellent written and verbal communication skills.

Competencies

• Values: Integrity, Accountability, Teamwork, Innovation
• Technical Leadership & Influence (Individual Contributor track)
• Problem Solving & Analytical Rigor