Job Overview

As a Principal Product Development Engineer in the Signal Integrity team, you will lead the aspects of electrical design, simulation, and verification-validation testing of high-speed products in the connector and/or cable assembly, radio system industry—targeting high-speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently drive product development teams in the areas of signal integrity for product and system design, including modeling, simulation, testing, and circuit board layout.  You will work collaboratively within a broader cross-functional team of mechanical, manufacturing, & operations to execute leading-edge product designs.  You will be the subject matter expert for the signal integrity performance of a product/platform, beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing.  You will be expected to enhance and drive the advancement of simulation tools and capabilities, identifying potential areas of process improvement, and be a respected authority in solving complex problems and ensuring product development success.

Responsibilities

• Subject matter expert in signal integrity design, simulation, and validation activities through product development cycles
• Establishing signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers
• Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
• Driving product development for business success
• Engaging in innovative simulation and test tool improvement and process enhancement
• Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint.
• Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences. Being an expert in analyzing competitive products and driving internal & competing IP positions

What your background should look like

Required Skills/Experience:

• Bachelor’s degree in electrical engineering or equivalent work experience; a Master’s degree is highly recommended.
• Minimum of  10 years of relevant work experience in electrical design, RF design, or PCB design.
• Highly proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools).
• A solid understanding of electromagnetic theory and electrical circuit behavior.
• Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problems. 
• Familiarity with printed circuit board design, fabrication, and assembly.  Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers.
• Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.
• Ability to, and experience with, teaching and training peers in applying software tools and methodologies, and in the use of electrical test equipment, including VNA’s and TDR’s.
• An individual must be highly motivated, a quick learner, and able to work independently

Nice to Have Skills/Experience:

• Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system.
• Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end, or similar systems).
• Solid presentation skills with an ability to communicate technical concepts to diverse audiences in English.
• Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction.
• Six Sigma methodologies or other strong data analytics background.
• Printed circuit board design, fabrication, and assembly (Altium, AutoCAD)
• Experience in project leadership, especially as it applies across design, development & manufacturing teams.
• Test equipment (oscilloscope, vector network analyzer, BERT).
• Signal conditioning techniques (equalization, amplification).
• Direct customer design and support experience.
• Application and test knowledge of high-speed devices and equalization techniques.
      

Competencies