Job Description
Job Title:  STAFF MANUFACTURING ENGINEER
Posting Start Date:  8/17/26
At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. 
Job Description: 

Job Overview

TE Connectivity, Sensors BU, is a world leader in the design and manufacture of Micro Electro-Mechanical Systems (“MEMS”) that lie at the heart of the advanced sensing market, enabling devices in the medical, industrial, digital consumer, security, and automotive sectors.

 

The company has established itself as a premier provider of MEMS-based pressure sensors for a range of markets, supplying advanced high and low-pressure sensor products that meet the stringent requirements for industry and consumer safety. TE Connectivity design, production and quality control processes have enabled it to develop both the smallest and smartest pressure sensors available today. TE offers a wide range of pressure sensors, including uncompensated sensors, temperature compensated and calibrated products as well as sensor systems consisting of an ASIC paired with a sensor die in a custom package.

 

The Staff Process/Manufacturing Engineer is responsible for being the expert for all wafer processing and development used in the fabrication of MEMS devices. This role requires applying engineering principles in materials science, manufacturing engineering, mechanical engineering, and semiconductor processing to support yield improvement, equipment qualification, tooling development, and process control.

 

The Engineer collaborates closely with Production, R&D, Quality, and global Engineering teams to evaluate process performance, implement statistical controls, and manage technical problem-solving across assigned product lines.  This person will be a mentor for young engineers and work to share knowledge to help advance others.

Essential Functions

Process Ownership & Improvement

  • Own and maintain process documentation, control plans, PFMEAs, and engineering standards for assigned production modules.
  • Ensure all manufacturing processes comply with quality, reliability, and performance specifications.

Product Line Engineering & Technical Expert 

  • Lead engineering activities for assigned MEMS or molded product lines, including yield optimization, customer technical support, and cross functional design reviews.
  • Drive cost reduction and quality improvement initiatives using Six Sigma, SPC, DOE, ANOVA, and root cause methodologies.

Production Support & Problem Resolution

  • Support daily manufacturing activities by evaluating defects, analyzing process data, and implementing corrective actions.
  • Lead disposition of non conforming material and coordinate failure analysis.

Process Development & Validation 

  • Develop, test, and document new or modified manufacturing processes driven by device design requirements or DOE outcomes.
  • Conduct qualification and validation of new production equipment, tooling, and metrology systems.
  • Provide guidance to process technicians and operators for respective process area and projects

Safety & Compliance 

  • Serve as champion for production safety programs and ensure compliance with internal and industry standards such as ISO 9001, ISO 13485, or TS 16949.

What your background should look like

Education, Skills and Experience Required

  • BS/MS in Mechanical, Electrical, Chemical, Manufacturing, or Materials Engineering (or closely related engineering field).
  • Hands‑on experience with semiconductor/MEMS wafer processing in a cleanroom environment.
  • Demonstrated data driven decision making
  • Proficiency with engineering tools such as metrology equipment, wafer probing systems, SPC/DOE software (Minitab/JMP).
  • Experience with process control, formal process release, and engineering documentation (PFMEA, control plans, specifications).
  • Strong analytical and statistical skills with demonstrated use of ANOVA, SPC, DOE, or advanced data analysis methods in production environment.

Desired Qualifications

  • Experience with MEMS fabrication (pressure sensors, accelerometers) or semiconductor wafer mapping formats (Klarf, XML).
  • Six Sigma Black Belt Certification
  • Experience with Pressure Sensor Characterization and application
  • Knowledge of MES or SAP systems; ability to extract and analyze large datasets (SQL, Tableau).
  • Experience with Python programming, and Labview desired
  • Experience with safety programs, equipment qualification, and supplier technical management.

Competencies

Values: Integrity, Accountability, Inclusion, Innovation, Teamwork

COMPENSATION

  • Competitive base salary commensurate with experience: $121,600 – $182,200 (subject to change dependent on physical location)
  • Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
  • Total Compensation = Base Salary + Incentive(s) + Benefits

Job Locations:

1701 McCarthy Road
Milpitas, California 95035
United States

Posting City:  Milpitas
Job Country:  United States
Travel Required:  Less than 10%
Requisition ID:  155924
Workplace Type:  Onsite
External Careers Page:  Engineering & Technology