STAFF R&D/PRODUCT DVL ENGINEER SIGNAL INTREGRITY (REMOTE)

Job Overview

TE Connectivity’s Office of the CTO, within the Digital Data Networks (DDN) organization, is driving innovation at the intersection of high-speed connectivity, compute, and AI infrastructure. As part of this mission, the Advanced Solutions Team (AST) develops early-stage interconnect platforms that power next-generation datacenters, AI/ML systems, and high-bandwidth communication networks.

Data communications applications are evolving at an exponential pace, and the DDN organization is at the forefront of enabling a more connected, data-driven world. Our customers are building the devices and infrastructure that are redefining information technology. To meet these rapidly shifting demands, we provide responsive, iterative, and agile development capabilities—staying focused on what matters most while adapting to the speed of innovation.

As a Staff Product Development Engineer in the Advanced Solutions Signal Integrity Team, you will lead advanced signal integrity (SI) modeling and validation for next-generation high-speed interconnects used in AI data centers, and high-performance computing (HPC). Your role involves independently conducting SI studies and design platforming, including geometry analysis and simulation-driven optimizations.

As a subject matter expert, you will oversee the entire SI lifecycle, from initial analysis and modeling to design, simulation, prototype fabrication, and final validation. You will tackle complex design challenges, leveraging advanced simulation tools to optimize designs for manufacturability and performance

Job Requirements

•    Drive SI design, simulation, and validation for next-gen high-speed interconnects (224G/448G PAM4/PAM6/PAM8, PCIe Gen7/8, Co-Packaged, and Near Package) through the product development cycle.
•    Conducting SI analysis, including
•    Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
•    Modeling the connector with the consideration of manufacture impact and application impact. 
•    Providing solutions to the SI challenges. This includes identifying the problems and working closely with the TE SI Center or Excellence (SI COE) community to develop solutions.
•    Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance.
•    Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation.
•    Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures.
•    Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization.
•    Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response.
•    Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs.

•    Bachelor’s degree in Electrical Engineering or equivalent amount of experience. 
•    Minimum of 8+ years of work experience in a signal integrity engineering role. 
•    Minimum of 6+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high-speed twin-ax cables, direct attach copper (DAC) cables) 
•    Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR, and BERT).
•    A solid understanding of statistical analysis and AI training. 
•    A solid understanding of electromagnetic theory and electrical circuit behavior 
•    Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problems.  
•    Strong understanding of printed circuit board design, fabrication, and assembly.  
•    Familiar with material, manufacturing process, and manufacture inspection. 
•    Familiar with at least one programming language, such as Matlab, Python, C++, VB, etc.
•    Excellent presentation, verbal, and written communication skills with an ability to clearly communicate technical concepts to diverse audiences
•    Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies
•    The individual must be highly motivated, a quick learner, and able to work independently

#LI-REMOTE

Competencies