STAFF ELECTRICAL SYSTEMS ENGINEER (REMOTE)

Job Overview

TE Connectivity’s Office of the CTO, within the Digital Data Networks (DDN) organization, is driving innovation at the intersection of high-speed connectivity, compute, and AI infrastructure. As part of this mission, the Advanced Solutions Team (AST) develops early-stage hardware platforms that power next-generation datacenters, AI/ML systems, and high-bandwidth communication networks.

Data communications applications are evolving at an exponential pace, and the DDN organization is at the forefront of enabling a more connected, data-driven world. Our customers are building the devices and infrastructure that are redefining information technology. To meet these rapidly shifting demands, we provide responsive, iterative, and agile development capabilities—staying focused on what matters most while adapting to the speed of innovation.

What your background should look like:

•    Define and architect high-speed interconnect products by developing system-level block diagrams, signal flow diagrams, and interface definitions.
•    Create and review schematics and hardware design using standard EDA tools.
•    Develop and maintain embedded firmware for microcontroller-based systems using C (and optionally Python or C++).
•    Implement and debug communication interfaces (e.g., I2C, SPI, MDIO, ADC/DAC, etc.) between embedded controllers and system components.
•    Collaborate with electrical, mechanical, and manufacturing teams to ensure design feasibility and manufacturability.
•    Support board bring-up, system integration, and lab validation of prototypes.
•    Analyze test data and lab measurements to diagnose system-level issues and propose design improvements.
•    Document system requirements, firmware architecture, interface specifications, and validation plans.
•    Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field
•    8+ years of experience in system-level hardware design and embedded software development.
•    Proficiency in embedded C and familiarity with firmware-hardware integration.
•    Strong hands-on experience in schematic capture (e.g., OrCAD, Altium, Mentor, or similar), component selection, and PCB-level electrical design.
•    Understanding of electrical fundamentals, including signal integrity, power integrity, power distribution, grounding, and high-speed signaling fundamentals.
•    Hands-on experience with test equipment (e.g., oscilloscopes, logic analyzers) for system validation.
•    Understanding of high-speed digital interfaces and protocols (PCIe, CXL, Ethernet, or similar) is a plus.
•    Experience working with redrivers, retimers, optical transceivers, or CPO architectures is highly preferred.
•    Strong problem-solving skills and the ability to work independently in a fast-paced, exploratory environment.
•    Effective communicator, able to present technical concepts to internal teams, customers, and industry partners.
•    Effectively able to build relationships with external customers, silicon partners, and industry leaders as well as internally across all levels, disciplines, and geographies
•    Self-motivated with the ability to take the initiative to accomplish tasks with limited directions. 
 

#LI-REMOTE

Required Skills

Bachelor’s degree in Mechanical Engineering or equivalent work experience. 

Generally requires 10 years of relevant mechanical engineering work experience with electrical components, electrical devices, mechanical structure design, manufacturing tooling development (stamping, molding, assembly, plating), or manufacturing process development. 

Knowledge in socket design, connector design, cable assembly design, or other relevant mechanic design and development, including but not limited to, material selection, tolerance analysis, DFMEA, product qualification, etc.  

Expert in 3D CAD applications (Creo preferred) with experience in 3D solid modeling including sheet metal, 2-D drawings, PDM link Data Manager and general knowledge in design applications such as Spaceclaim, Solidworks, or others used only in the concept stage.                          

Expert in geometric dimensioning & tolerancing (GD&T).  

Expert at limit and fit analysis including statistical tolerance analysis. 

Proficient user of finite element analysis software (Ansys, Workbench) including elastic and plastic behavior of metals. 

Proficient in developing and writing design objectives for product specifications. 

In depth knowledge in manufacturing process (machining, molding, stamping, plating, assembly, etc.) with experience driving Design for Manufacturing (DFM) and best practices.    

Experienced in providing technical leadership for the full product development cycle, from establishing customer requirements to releasing qualified design to production. 

Solid understanding of competitive products and intellectual property positions. 

Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. 

Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies. 

Expert problem solver – able to handle high complexity situations and use data analytics and critical thinking to reach logical conclusions with limited direction. 

Proficient using MS office software (Word, Excel, PPT, Outlook, MS Teams, etc.). 

Competencies