Manage and lead a team of regional/global signal integrity engineers in establishing signal integrity design performance and functional requirements for new products 

Lead the team to perform signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. 

Guide the team in connector design and qualifications from a signal integrity standpoint with a focus on making data driven decisions about the product functionality and areas for improvement. 

Create actionable recommendations based upon design reviews and simulation results. 

Lead the team in communicating actions and impacts clearly to stakeholders including management, customers, and the technical community. 

Align the technology roadmap with the market trends, customer needs, and implement accordingly. 

Drive a culture of innovation using a base of traditional approaches and external knowledge to develop innovative solutions. 

Effectively lead a regional/global team of SI engineers of varying levels of experience with different backgrounds, experiences, and cultures. 

Drive high performance by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability.  

Manage employee wellbeing by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives. 

Bachelor’s degree in Electrical Engineering or equivalent work experience; Master's Degree preferred 

Generally requires 10 years of relevant work experience in electrical Design, RF design or PCB design 

Generally requires a minimum of 3 years of progressive leadership and people management experience in a regional environment 

A solid understanding of electromagnetic theory and electrical circuit behavior 

Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) 

Proficient with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent) 

Proficient with high-speed test equipment (VNA, TDR, BERT) 

Proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.