EMI & SI TEST MGR I R&D/PRODUCT DVL ENGINEERING

Job Overview

Do have a passion for high-speed and RF testing and modeling? At TE Connectivity, you will find a culture that rewards such hands-on engineering spirit. We empower our engineering teams to work collaboratively to support our customer’s need for high-speed communication products. This is a great opportunity to join TE and lead our Signal Integrity testing team and Electromagnetic Compatibility (EMC) testing and modeling team.

What you will be doing...
As a leader of the Electromagnetic Interference (EMI) / Electromagnetic Compatibility (EMC) team and the Signal Integrity (SI) testing team, you will lead the teams in supporting the RF design, testing, and characterization of high-speed TE Connectivity products. The right candidate will participate in projects managing the process, procedures, and equipment associated in multiple global high-speed labs. You will have the opportunity to both develop strategy, direct, optimize, and get hands-on with technical day-to-day activities.

Responsibilities:
• Responsible for maintaining and enhancing the processes, procedures, and equipment associated with multiple high-speed electrical test labs. 
• Ensure that processes and procedures are correctly followed.
• Interface with engineering, manufacturing, and product teams globally to prioritize, manage, and track tasks and workload.
•  Interface with both internal/external customers and vendors along with engineering, to ensure labs are properly equipped.
• Maintain safety and EHS compliance, for multiple labs.
• Create and maintain a strategic capabilities plan and align labs accordingly.
• Track/monitor metrics for sustained performance covering data quality & delivery.
• Understand the financial influence/impact of activities.
• Improve accuracy and efficiency of data.

What your background should look like:

Requirements:
• Minimum of Bachelor’s degree with EE related background
• 8+ years in a lab environment, electrical testing role, and/or high-speed/RF/SI/EMC discipline
• 5+ years in a management or leadership role
• Excellent verbal and written communication skills, be highly motivated, and a quick learner.
• Fluent communication skills to be able to articulate well with teams across different functions & locations.
• Able to manage requests, address customer requirements and work effectively with different cross functional teams.
• Proficiency with MS Office Tools
• Able to supervise and manage teams by ensuring compliance processes at TE and keep them motivated.
• Have an understanding of RF and electromagnetic principles.
 

Other Relevant experience:

• Spectrum and/or Network Analyzers
• Mode-stirred and/or Anechoic Chambers
• Antennas and Amplifiers
• 2D/3D CAD Tools
• Soldering
• Keysight ADS, PLTS, Python, MATLAB, Vee, SNPexpert, and/or LabView Software
• Experience with high-speed test equipment (VNA, TDR, PIM tester, Oscilloscope, Pattern Generator, BERT, Multimeter).
• Familiarity with printed circuit board design, fabrication and/or assembly.
• Connector and cable assembly knowledge.
 

Competencies