Job Overview

MGR II – R&D/Product Development Engineering (High Speed IO)

BU and Function Description
The High Speed IO engineering team within Digital Device Network (DDN) Business Unit is responsible for the development of advanced high-speed interconnect solutions used in hyperscale computing, AI systems, data centers, cloud infrastructure, and next-generation communication platforms.
The team focuses on high-speed connectors, cable assemblies, and system-level interconnect solutions supporting cutting-edge protocols (e.g., PCIe, Ethernet, MSA, etc.), ensuring signal integrity, power integrity, and system performance.

Role Objective
As a Product Development Engineering Manager, you will lead a team responsible for research, design, and development of High Speed IO products aligned with customer requirements and future technology roadmap. You will drive innovation in high-speed signal transmission, ensuring robust product design, system performance, and successful product commercialization.

Job Requirements

•    Lead team to research, develop, and sustain High Speed IO products across full lifecycle (concept to mass production)
•    Manage performance goals aligned with organization strategy; conduct regular reviews and feedback
•    Oversee end-to-end new product development (NPI) including design, simulation, validation, and release
•    Coach and develop team members to build a high-performance engineering organization
•    Drive continuous improvement of engineering tools, methodologies, and development processes
•    Define and execute High Speed IO technology roadmap aligned with industry trends and customer needs
•    Work closely with customers, sales, and PM to capture Voice of Customer (VOC), especially system-level SI requirements
•    Lead engineering execution following LEANPD/stage-gate processes, ensuring delivery on time, quality, and cost
•    Develop and maintain product documentation: specifications, SI reports, design guidelines, test plans, and validation reports
•    Collaborate with global manufacturing, procurement, and suppliers to meet technical, quality, and cost targets
•    Lead component and technology qualification, especially for high-speed materials and signal-critical structures
•    Ensure thorough design verification & validation, including SI/Thermal simulations, high-speed measurements (TDR, VNA, eye diagram, BER)
•    Partner with manufacturing teams to ensure smooth product ramp and yield optimization
•    Provide strong technical interface to customers on system integration, debugging, and performance optimization
•    Conduct competitive analysis and track industry trends in high-speed interconnect technologies
•    Build deep understanding of system-level applications (servers, switches, accelerators, etc.)
•    Drive innovation through collaboration with global teams and technology centers
•    Apply engineering best practices to optimize performance, cost, and manufacturability

What your background should look like

Education and Knowledge
Typically requires:

• Bachelor’s degree with 10+ years experience, OR
• Master’s degree with 6+ years, OR
• PhD with 3+ yearsMinimum 
• 3+ years leadership/people management experience
• Strong background in electrical/mechanical engineering with emphasis on high-speed interconnect design
• Deep expertise in High Speed IO technologies, including: 
• Signal Integrity (SI) and Thermal
• High-speed protocols (PCIe, Ethernet, MSA, CXL, etc.)
• Channel modeling and link budget analysis
• Experience with product development lifecycle (design, prototyping, testing, qualification)
• Familiarity with simulation and design tools: SI tools (e.g., HFSS)
• 3D CAD and mechanical design tools
• Knowledge of materials for high-speed applications (low-loss dielectric, plating, cable structures)
• Understanding of manufacturing processes (stamping, molding, plating, assembly, etc.)
• Experience with reliability, compliance, and high-speed test methodologies
•  Familiarity with quality tools (FMEA, DOE, Six Sigma, 8D)

Competencies