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Process Engineer 1st Level Packaging (f/m/d)

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. 

Job Overview

TE Connectivity's Manufacturing and Process Development Engineering Teams significantly impact LEANPD driven new product development projects, driving for excellence in existing manufacturing technologies and methods and striving to implement new manufacturing technologies to provide improved process and tolerance control. They act as the binding element between product development and manufacturing engineering, ensuring the effectiveness and efficiency of this critical interface. They support Product Development in the optimization of designs and piece parts for manufacturability by realizing sample tooling/products/prototypes. They also design, develop, and qualify tooling and processes to meet TE quality and production standards, document all processes and tooling in applicable TE systems, support supply chain to verify supplier compliance and capability, initiate and implement programs to continuously improve quality, cost and cycle time and adhere to all appropriate specifications, regulatory requirements and customer requirements.

 

What your background should look like:

  • You are the process technology expert and responsible for 1st-level-packaging assembly and interconnection technologies of pressure sensor electronic modules.
  • You are the interface between Product Development Engineering and Manufacturing Engineering at different manufacturing sites.
  • You take care of the process development, the transfer to production and execute process releases.
  • You are the owner of DfMA, process specification and qualification for assembly processes, installations, and production equipment.
  • You are planning and execute DoE trials to achieve both product performance and process robustness.
  • You drive standardizing, improvement and optimization of process engineering in terms of quality and economic efficiency (VAVE) for demanding applications in the transportation sector.
  • You support external and internal suppliers to evaluate the technology portfolio and to accompany test, sample and prototype builds.
  • You perform process technology benchmarks and state-of-the-art analysis.

Your Profile

  • Bachelor’s or Master’s degree in Engineering or other equivalent technical discipline
  • Minimum of 5-10 years of related market or engineering experience
  • Specific experience in packaging technologies, substrates and bonding materials (SMT, COB, MEMS-specific, adhesive, encapsulation/potting etc.)
  • Knowledge of typical process errors and their causes in microelectronic packaging (P-FMEA)
  • Familiar with relevant standards in chip and electronics assembly, e.g. IPC-A-610G, ISO 16232/VDA Technical Cleanliness, ISO 14644
  • Six Sigma certification and statistical methods for data analysis are a plus
  • Ability to proactively drive projects with minimal guidance or supervision
  • Open-minded to working in an international environment and communicating globally
  • Excellent communication skills (written and verbal) in English and German
  • Energetic and highly motivated
  • Willingness to travel up to 25%

Competencies

Values: Integrity, Accountability,Teamwork, Innovation
Location: 

Dresden, SN, DE, 01099

City:  Dresden
State:  SN
Country/Region:  DE
Travel:  10% to 25%
Requisition ID:  76980
Alternative Locations: 
Function:  Engineering & Technology


Job Segment: Electronics Engineer, Process Engineer, Package Design, Engineer, Manufacturing Engineer, Engineering, Manufacturing

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