Sr Signal Integrity Engineer

Job Overview

TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems.

KEY RESPONSBILITIES:

Bachelor’s degree in Electrical Engineering or equivalent work experience 

5 years of relevant work experience in electrical design, RF design, or PCB design 

Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) 

A solid understanding of electromagnetic theory and electrical circuit behavior  

Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.   

Familiarity with printed circuit board design, fabrication and assembly.   

Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. 

Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies. 

Individual must be highly motivated, a quick learner, and able to work independently 

DESIRED SKILLS:

Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system 

Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) 

Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English 

Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. 

SixSigma methodologies or other strong data analytics background. 

Printed circuit board design, fabrication and assembly (Altium, AutoCAD) 

Experience in project leadership, especially as it applies across design, development & manufacturing teams 

Test equipment (oscilloscope, vector network analyzer, BERT) 

Signal conditioning techniques (equalization, amplification) 

Direct customer design and support experience 

Application and test knowledge of high-speed devices and equalization techniques 

Competencies