SR R&D/PRODUCT DVL ENGINEER

About TE:

TE Connectivity Ltd. is a $16 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com

BU / Function

Digital Data & Networks (DDN) Business Unit in TE Connectivity, where we enable high-speed connectivity solutions that power today’s and tomorrow’s data-driven world. Engineering team is responsible for development of innovative interconnect solution products which are used in hyperscale computers, AI, Datacenter, Cloud server, and other IT systems, including connectors, cable assemblies, bus bars and sockets. We engineer and manufacture cutting-edge interconnect solutions that support high-speed data transmission, signal integrity, and power efficiency.

Role Objective and Responsibilities:

A PCB Simulation Engineer in PCB Simulation Team, Digital Data Networks (DDN) business in TE Connectivity, validates electronic designs by conducting electrical, signal integrity, power integrity, EMC, RF and thermal simulations to ensure optimal performance, reliability, and manufacturability. The responsibilities include analysing circuit designs, utilizing specialized simulation software, troubleshooting issues through modelling, and collaborating with cross-functional teams to meet project specifications before physical prototyping.

Key Responsibilities

• Circuit Simulation: Perform electrical, signal integrity (SI), power integrity (PI), EMC, RF and thermal simulations to predict and validate circuit behaviour and identify potential performance issues.

• Design Optimization: Use simulation results to optimize component placement, routing, and overall design for performance, reliability, and manufacturability (DFM) in collaboration with PCB Design Team.

• Analysis and Validation: Coordinate design validation activities with PCB Design Team for design rule checks (DRC) and performance evaluations to ensure designs meet requirements.

• Software Proficiency: Utilize high speed PCB simulation tools (e.g. SIwave/HFSS, Pathwave ADS, SIPro, HyperLyx, Sigrity, CST Studio Suite, EMC Plus, Microwave Office, ICEPAK/FLOTHERM/CELSIUS etc.) to simulate and analyse designs.

• Collaboration: Work with cross-functional teams, including electrical, mechanical, and manufacturing engineers, to define requirements and resolve design challenges.

• Documentation: Prepare and maintain detailed documentation, including simulation reports, test procedures, and specifications, for project records.

• Problem-Solving: Troubleshoot design issues and recommend improvements based on simulation and testing feedback.

• Research and Development: Stay updated on industry trends, emerging technologies, and best practices in high-speed PCB simulation and design to enhance design processes.

What your background should look like

Education:

• A bachelor’s degree in electrical or electronics engineering from a premier institute/university. A master’s degree in a related field is preferred. Consistent performance throughout entire academics (e.g. STD-X onwards).

Experience:

• Around 4-6 years of extensive hands-on experience in high-speed PCB simulation, with a proven track record of successfully delivering complex projects with deadlines.

• Proficient and foundational knowledge on printed circuit board layout, libraries and schematics, routing, manufacturability and testing.

Technical Skills:

• Expertise with simulation tools for high-speed electrical and thermal analysis  Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.

• Expertise with high-speed electronic circuit design principles, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.

• Good understanding of PCB design and layout tools such as Cadence Allegro, Altium Designer, or Siemens PADS.

• Good knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM) and design for testing (DFT).

Soft Skills:

• Passion for Technology and scientific/engineering excellence.

• Excellent problem-solving and analytical skills to resolve complex technical issues.

• Strong in Technical Documentations and Report preparation.

• Strong verbal and written communication skills to articulate complex technical concepts to both technical and non-technical stakeholders.

• Ability to work effectively in a fast-paced, collaborative global environment and global time zones.

• A team player and self-starter and works independently with minimal supervision and instructions.

• Able to prioritise work, take self-care and manage personal well-being.