Engineering Leadership Development Program

Job Overview

TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems.

Responsibilities & Qualifications

Responsibilities:

As an Engineering Rotational Leadership Associate, your responsibilities may include experiences in the following areas:
•Plastic & Metal Design

•Mechanical Design – Pressure Sensors (fixturing, testers, tooling, component parts, testing, reporting), Temperature Sensors (including Design for Manufacturing), Inductive Product Design (LVDT, LVIT, RVIT, Pulsers, encoders), Pressure Transmitters, packaging design for electronics enclosures.

•Electronic Design – Signal conditioning electronics, ASIC evaluation & programming, firmware, test systems; Inductive signal conditioning design, PCB design & layout, systems testing; Circuit Design for ultrasonic level & gap sensors, redesigning & upgrading existing products; Ultrasonic systems design, modeling, simulation & algorithm development; High speed digital systems, FPGA design;
•Plant & Test Lab Experience
•Development, Manufacturing & Quality Engineering
•TEOA/Six Sigma

Qualifications:
•Eligible candidates will graduate between December 2017 and June 2018 with 0-3 years industry experience
•Bachelor's degree in Mechanical/Industrial/Electrical Engineering or related discipline
•Minimum GPA in major of 3.0
•Previous internship and/or work experience preferred
•Geographically mobile
•Leadership experience preferred

Competencies

• Values: Integrity, Accountability,Teamwork, Innovation